| SMS3400HAX3CM - AMD Mobile
Sempron 3400+ Microprocessor 1.8GHz General information
Type CPU / Microprocessor
Family AMD Mobile Sempron
Stepping code LEBAF
Frequency (MHz) ? 3400+ (rated)
1800 (real)
Package 638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm)
Socket S1
Architecture / Microarchitecture
Manufacturing process 0.09 micron
Data width 64 bit
Floating Point Unit Integrated
Level 1 cache size ? 64 KB instruction cache
64 KB data cache
Level 2 cache size ? 256 KB
Features
* MMX Technology
* 3DNow!
* SSE
* SSE2
* SSE3
* AMD64 technology ?
* Enhanced Virus Protection ?
Low power features PowerNow! technology
On-chip peripherals
* Dual-channel DDR2 SDRAM memory controller
* One 16-bit HyperTransport link with speeds up to 800 MHz
Electrical/Thermal parameters
V core (V) ? 1.125 / 1.15 / 1.2
Max operating temperature (°C) ? 95
Thermal Design Power (W) ? 25 |