| AMA3700BEXSAR - AMD Mobile
Sempron 3700+ Microprocessor 2.4GHz General information
Type CPU / Microprocessor
Family AMD Mobile Sempron
Stepping codes CAAXC
Frequency (MHz) 3700+ (rated)
2000 (real)
Package 754-pin lidless organic micro-PGA
Socket 754
Architecture / Microarchitecture
Floating Point Unit Integrated
Level 1 cache size: 64 KB instruction cache
64 KB data cache
Level 2 cache size : 128 KB
Features EVP_XD
Low power features PowerNow! technology
On-chip peripherals
* Single-channel DDR SDRAM memory controller
* One 16-bit HyperTransport link with speeds up to 800 MHz
Electrical/Thermal parameters
V core (V) : 1.2
Max operating temperature (°C) : 95
Thermal Design Power (W) : 25 |